ASMPT and IBM Expand Collaboration for Chiplet Packaging Technology Innovation

Jakarta, INTI - ASMPT and IBM (NYSE: IBM) today announced a new agreement to expand their collaboration in the development of next-generation chiplet packaging technology. Through this agreement, the two companies will work together to advance thermo-compression and hybrid bonding technologies for chiplet packages, using ASMPT's next-generation Firebird TCB and Lithobolt hybrid bonding tools.

Chiplets represent a new approach that deconstructs system-on-chip (SoC) into its composite parts, creating smaller chips that can then be packaged together to operate as a single system. This approach offers potential benefits, including increased energy efficiency, faster system development cycle times, and reduced costs. However, packaging advancements are necessary to move chiplets from research to mass production more quickly and efficiently, driven by the rapid pace of innovation in artificial intelligence (AI) computing.

Advantages and Goals of the Collaboration

This latest agreement builds on the existing collaboration between ASMPT and IBM, which last year resulted in the debut of a new hybrid bonding approach that optimizes the bonding quality between two chiplets. They will now continue to work together on bonding technology development for chiplet packages.

"IBM has been at the forefront of developing advanced packaging technologies for the AI era," said Huiming Bu, Vice President of IBM Semiconductors Global R&D and Albany Operations, IBM Research. "We are proud to continue our work with ASMPT to advance chiplet packaging technology to pave the way for smaller, more powerful, and more energy-efficient chips."

"We are very excited to build on our strong relationship with IBM to push the boundaries of advanced packaging while accelerating innovation in artificial intelligence," said Lim Choon Khoon, Senior Vice President, ASMPT. "We look forward to working together with IBM to advance next-generation packaging solutions and heterogeneous integration for the AI era."

Latest Statistics and Data

According to a recent report from the International Data Corporation (IDC), the global semiconductor market is expected to grow at a CAGR of 5.3% from 2022 to 2027. Innovations in chiplet packaging technology, such as those being developed by ASMPT and IBM, are expected to play a key role in driving this growth. Additionally, chiplet packaging technology can reduce power consumption by up to 20% and improve system performance by up to 30%, according to research from Gartner.

Challenges and Solutions

One of the main challenges in chiplet packaging is ensuring consistent bonding quality between different chiplets. The hybrid bonding technology developed by ASMPT and IBM has shown significant improvements in this area, enabling more reliable and efficient mass production. Thermo-compression technology also plays a crucial role in this process, ensuring that chiplets can be integrated quickly and at a lower cost.

Future of Chiplet Packaging Technology

With this collaboration, ASMPT and IBM are committed to continually pushing the boundaries of chiplet packaging technology. They plan to introduce new solutions that will enable faster, more efficient, and more cost-effective chiplet production, supporting rapid advancements in AI technology.

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